XC7Z100-2FFG1156I

XC7Z100-2FFG1156I

-40°C~100°C TJ System On ChipZynq?-7000 Series 250 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z100-2FFG1156I
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 570
  • Description: -40°C~100°C TJ System On ChipZynq?-7000 Series 250 I/O1V (Kg)

Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 1156-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B1156
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 250
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 444K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.1mm
Length 35mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package.A 256KB RAM SoC chip provides reliable performance to users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.In addition, this SoC security combines Kintex?-7 FPGA, 444K Logic Cells.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part includes 250 I/Os.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supplies of at least 0.95V are required.A wireless SoC that operates at a frequency of 800MHz is what the wireless SoC does.In order to operate the SoC meaning, it must be based on the core architecture of ARM.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z100-2FFG1156I System On Chip (SoC) applications.

  • Central alarm system
  • DC-input BLDC motor drive
  • Industrial AC-DC
  • Multiprocessor system-on-chips (MPSoCs)
  • Special Issue Editors
  • USB hard disk enclosure
  • String inverter
  • Apple smart watch
  • Measurement tools
  • ARM

Write a review

Note: HTML is not translated!
    Bad           Good