XC7Z030-3SBG485E
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 484-FBGA, FCBGA |
| Number of Pins | 485 |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 485 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other Microprocessor ICs |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1V |
| Terminal Pitch | 0.8mm |
| Frequency | 1GHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.05V |
| Power Supplies | 11.8V |
| Supply Voltage-Min (Vsup) | 0.95V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| UV Erasable | N |
| Height Seated (Max) | 2.44mm |
| Length | 19mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.Its package is 484-FBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.The system on a chip is part of the series Zynq?-7000.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 125K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.It is recommended to use a 1V power supply.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supply should be at least 0.95V.Having 485 terminations in total makes system on a chip possible.The system on a chip capability is outstanding just like it is for other high-quality Other Microprocessor ICs.You will need to provide 11.8V power supplies in order to run system on chip.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.1GHz is the wireless SoC's frequency.In order to operate the SoC meaning, it must be based on the core architecture of ARM.Moreover, this SoC processor comes with PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The computer SoC has 485 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z030-3SBG485E System On Chip (SoC) applications.
- POS Terminals
- Functional safety for critical applications in the aerospace
- External USB hard disk/SSD
- Print Special Issue Flyer
- Robotics
- AC drive control module
- Video Imaging
- Automotive gateway
- Medical
- Central alarm system