XC7Z030-2FFG676E
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Package / Case | 676-BBGA, FCBGA |
| Surface Mount | YES |
| Number of Pins | 676 |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC7Z030 |
| Operating Supply Voltage | 1V |
| Supply Voltage-Max (Vsup) | 1.05V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | -2 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Height Seated (Max) | 3.24mm |
| Length | 27mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series Zynq?-7000.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.In the SoCs wireless, voltages above 1.05V are considered unsafe.In total, there are 676 terminations, so system on a chip is really aided by this.By searching XC7Z030, you can find system on chips with similar specs and purposes.It operates at a frequency of 800MHz.Based on the core architecture of ARM, the SoC meaning has a high level of performance.676 pins are present on this computer SoC.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-2FFG676E System On Chip (SoC) applications.
- Automotive gateway
- Digital Signal Processing
- Industrial automation devices
- Body control module
- Self-aware system-on-chip (SoC)
- Measurement tools
- Servo drive control module
- Smart appliances
- RISC-V
- Efficient hardware for inference of neural networks