XC7Z030-1SBG485I
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 484-FBGA, FCBGA |
| Number of Pins | 485 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 485 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other Microprocessor ICs |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1V |
| Terminal Pitch | 0.8mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.05V |
| Power Supplies | 11.8V |
| Supply Voltage-Min (Vsup) | 0.95V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| UV Erasable | N |
| Height Seated (Max) | 2.44mm |
| Length | 19mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 484-FBGA, FCBGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.Housed in the state-of-art Tray package.In total, this SoC part has 130 I/Os.A 1V power supply is recommended.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supplies of at least 0.95V are required.system on a chip benefits from 485 terminations.Just like other high-quality Other Microprocessor ICs will do, it is of outstanding system on a chip capability.There is 11.8V power supply required for system on chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.At 667MHz, the wireless SoC works.It uses ARM as its core architecture.Moreover, this SoC processor is also equipped with additional features of PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.This is the version with 485 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z030-1SBG485I System On Chip (SoC) applications.
- Optical drive
- Multiprocessor system-on-chips (MPSoCs)
- Industrial
- Efficient hardware for training of neural networks
- Apple smart watch
- Industrial sectors
- Robotics
- AC drive control module
- Automotive
- Self-aware system-on-chip (SoC)