OM13497UL

OM13497UL

SURFACE MOUNT TO DIP EVALUATION


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-OM13497UL
  • Package: -
  • Datasheet: PDF
  • Stock: 878
  • Description: SURFACE MOUNT TO DIP EVALUATION (Kg)

Details

Tags

Parameters
Factory Lead Time 16 Weeks
Package Accepted HTSSOP, VFBGA, XFBGA
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Number of Positions 24
Specifications SMD to DIP
Quantity 18 Pieces (3 Values - 6 Each)
Kit Type Adapter, Breakout Boards
RoHS Status ROHS3 Compliant
See Relate Datesheet

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