MEC1-105-02-F-D-A
| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Contact Material | Beryllium Copper |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Housing Material | Polymer |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Tube |
| Published | 2008 |
| Series | MEC1 |
| JESD-609 Code | e3 |
| Feature | Board Guide |
| Part Status | Active |
| Termination | Solder |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 10 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Additional Feature | POLARIZED |
| Subcategory | Headers and Edge Type Connectors |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Contact Type | Loop Bellows |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.039 1.00mm |
| Total Number of Contacts | 10 |
| Orientation | Straight |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 0.376 inch |
| Number Of PCB Rows | 2 |
| PCB Contact Pattern | RECTANGULAR |
| Body Depth | 0.356 inch |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Body/Shell Style | SOCKET |
| Max Voltage Rating (AC) | 300V |
| Mating Contact Row Spacing | 0.05 inch |
| Contact Finish Thickness | 3.00μin 0.076μm |
| Plating Thickness | FLASH inch |
| Card Thickness | 0.062 1.57mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
MEC1-105-02-F-D-A Overview
Materials were packaged according to Tube's specs.There is a recommendation for mounting type Surface Mount.A connector socket CARD EDGE CONNECTOR is used for connecting the device.There are Board Guide features on the device.MEC1 tells you the series of the device.Several additional features are included with this chip: POLARIZED
MEC1-105-02-F-D-A Features
MEC1 series
MEC1-105-02-F-D-A Applications
There are a lot of Samtec Inc. MEC1-105-02-F-D-A Edgeboard Connectors applications.
- CMOS Image sensors for mobile applications
- Instrumentation and test equipment
- Scientific instruments.
- Battery Operated Systems
- Industrial Process Control
- Automotive
- Audio/Video devices
- Music reproduction technology
- Music recording
- Telecommunications