GSM08DRAI
| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Contact Material | Phosphor Bronze |
| Mount | Through Hole |
| Mounting Type | Through Hole, Right Angle |
| Material - Insulation | Polyamide (PA9T), Nylon 9T |
| Operating Temperature | -65°C~125°C |
| Packaging | Tray |
| Published | 2008 |
| JESD-609 Code | e4 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Connector Type | Full Bellows |
| Number of Positions | 16 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Subcategory | Headers and Edge Type Connectors |
| Contact Type | Full Bellows |
| Pitch | 0.156 3.96mm |
| Total Number of Contacts | 16 |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Number Of PCB Rows | 2 |
| PCB Contact Pattern | RECTANGULAR |
| Body Depth | 0.431 inch |
| Rated Current (Signal) | 3A |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 8 |
| Flange Feature | Top Mount Opening, Threaded Insert, 4-40 |
| Contact Finish Thickness | 10.0μin 0.25μm |
| Plating Thickness | 10μin |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
GSM08DRAI Overview
Packaging was done to Tray's specifications.It is recommended to mount the device using mounting type Through Hole, Right Angle.The device is connected by using the connector socket Full Bellows.
GSM08DRAI Features
GSM08DRAI Applications
There are a lot of Sullins Connector Solutions GSM08DRAI Edgeboard Connectors applications.
- 3-phase power control
- Instrumentation and test equipment
- Displaying
- Broadband data applications
- Imaging Systems
- Battery Operated Systems
- Digital signal processing
- CMOS Image sensors for mobile applications
- AC motor control
- Data Acquisition Systems